Rb. Den Haag, 20-09-2017, nr. C/09/515892 / HA ZA 16-906

Asetek is opgericht door [A], de uitvinder genoemd in het hierna te bespreken octrooi EP 1 923 771. Asetek is naar eigen zeggen marktleider voor vloeistofkoelsystemen voor onder meer desktop PC’s.

Cooler Master is actief in dezelfde markt en verhandelt een drietal vloeistofkoelstystemen: de Seidon 120V Ver.2, de Nepton 120XL en de Nepton 240M.

Het octrooi EP 1 923 771

Asetek is houdster van Europees octrooi EP 1 923 771 B1 (hierna: EP 771 of ‘het octrooi’) voor een “Cooling system for a computer system”. Op 8 november 2004 heeft zij, met een beroep op prioriteit van de Amerikaanse octrooiaanvrage US 517924 P van 7 november 2003 (hierna: het prioriteitsdocument of US 924) een (internationale) aanvrage daartoe ingediend. EP 771 is op 20 mei 2015 verleend. De termijn voor het instellen van oppositie is verstreken zonder dat oppositie is ingesteld.

In de oorspronkelijke Engelse taal luiden de conclusies van EP 771 als volgt1.:

1. A cooling system for a computer system, said computer system comprising

- at least one unit such as a central processing unit (CPU) (1) venerating thermal energy and said cooling system intended for cooling the at least one processing unit (1) and the cooling system comprising

- a liquid reservoir housing (14) comprising an inlet tube connection (15) and an outlet tube connection (16) both attached to the reservoir housing (14),

- a heat radiator (11) connected by means of connecting tubes (24, 25) to the inlet tube connection (15) and the outlet tube connection (16) of the reservoir hosing (14),

- a liquid reservoir provided in the reservoir housing (14), said liquid reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit (1) to the cooling liquid, wherein the reservoir is further provided with channels (26) for establishing a certain flow-path for the cooling liquid,

- a pump (21) being provided inside said reservoir housing (14) as part of an integrate element, said pump (21) comprising an impeller (33) which is positioned in a separate recess of the channels (26), where the recess has a size corresponding to the diameter of the impeller of the pump, and has a recess inlet (34) and a recess outlet (32) which is connected to the outlet tube connection (16),

- a heat exchanger comprising a heat exchanging interface (4) for providing thermal contact between the processing unit (1) and the cooling liquid for dissipating heat from the processing unit (1) to the cooling liquid, where the heat exchanging interface (4) comprises a heat exchanging surface that constitutes part of the liquid reservoir housing (14) facing the processing unit (1),

where the channels (26) face an inner surface of the heat exchanging interface forcing the cooling liquid to pass the heat exchanging surface,

said integrate element comprising the heat exchanging interface (4), the reservoir housing (14) and the pump (21), wherein

- said pump (21) is intended for pumping the cooling liquid from the heat radiator (11) into the reservoir housing (14) through the tube inlet connection (15), through the channels (26), into the pump through the recess inlet (34) and from the pump (21) through the recess outlet (32), through the channels and the tube outlet connection (16) to the heat radiator (11),

- said heat radiator (11) intended for radiating thermal energy from the cooling liquid, dissipated to the cooling liquid, to surroundings of the heat radiator (11).

2. A cooling system according to claim 1, wherein the reservoir further has a non-smooth inner wall.

De niet-betwiste Nederlandse vertaling van de conclusies luidt als volgt:

1. Koelsysteem voor een computersysteem, waarbij genoemd computersysteem omvat

- ten minste één eenheid zoals een centrale verwerkingseenheid (CPU) (1) die thermische energie genereert en waarbij genoemd koelsysteem is bedoeld voor het koelen van de ten minste ene verwerkingseenheid (1) en waarbij het koelsysteem omvat

- een vloeistofreservoirbehuizing (14) omvattende een inlaatbuisverbinding (15) en een uitlaatbuisverbinding (16) die beiden zijn bevestigd aan de reservoirbehuizing (14),

- een warmteradiator (11) die verbonden is door middel van verbindingsbuizen (24, 25) met de inlaatbuisverbinding (15) en de uitlaatbuisverbinding (16) van de reservoirbehuizing (14)

- een vloeistofreservoir dat is verschaft in de reservoirbehuizing (14), waarbij genoemd vloeistofreservoir een hoeveelheid koelvloeistof heeft, waarbij genoemde koelvloeistof is bestemd voor het accumuleren en overbrengen van thermische energie die is gedissipeerd door de verwerkingseenheid (1) aan de koelvloeistof, waarbij het reservoir verder is voorzien van kanalen (26) voor het bewerkstelligen van een zeker stroompad voor de koelvloeistof,

- een pomp (21) die is verschaft in genoemde reservoirbehuizing (14) als onderdeel van een integraal element, waarbij genoemde pomp (21) een impeller (33) omvat die in een afzonderlijke uitsparing van de kanalen (26) is gepositioneerd, waarbij de uitsparing een grootte heeft die overeenkomt met de diameter van de impeller van de pomp, en een uitsparinginlaat (34) en een uitsparinguitlaat (32) welke is verbonden met de uitlaatbuisverbinding (16),

- een warmtewisselaar omvattende een warmtewisselingsinterface (4) voor het verschaffen van thermisch contact tussen de verwerkingseenheid (1) en de koelvloeistof voor het dissiperen van warmte van de verwerkingseenheid (1) naar de koelvloeistof, waarbij de warmtewisselingsinterface (4) een warmtewisselingsvlak omvat dat een gedeelte vormt van de vloeistofreservoirbehuizing (14) welke gekeerd is naar de verwerkingseenheid (1),

waarbij de kanalen (26) zijn gekeerd naar een binnenvlak van de warmtewisselingsinterface om de koelvloeistof te forceren om langs het warmtewisselingsvlak te passeren,

waarbij genoemd integraal element de warmtewisselingsinterface (4), de reservoirbehuizing (14) en de pomp (21) omvat, waarbij

- genoemde pomp (21) is bestemd voor het pompen van de koelvloeistof van de warmteradiator (11) in de reservoirbehuizing (14) door de buisinlaatverbinding (15), door de kanalen (26), in de pomp door de uitsparingsinlaat (34) en van de pomp (21) door de uitsparingsuitlaat (32), door de kanalen en de buisuitlaatverbinding(16) naar de warmteradiator (11),

- genoemde warmteradiator (11) is bestemd voor het uitstralen van thermische energie van de koelvloeistof, gedissipeerd naar de koelvloeistof, naar een omgeving van de warmteradiator (11).

2. Koelsysteem volgens conclusie 1, waarbij het reservoir verder een niet-gladde binnenwand

heeft.

Conclusie 1 kan worden opgesplitst in de volgende deelkenmerken:

1. A cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) (1) venerating thermal energy and said cooling system intended for cooling the at least one processing unit ( 1)

2. and the cooling system comprising a liquid reservoir housing (14) comprising an inlet tube connection (15) and an outlet tube connection (16) both attached to the reservoir housing (14)

3. a heat radiator (11) connected by means of connecting tubes (24, 25) to the inlet tube connection (15) and the outlet tube connection (16) of the reservoir housing (14)

4. a liquid reservoir provided in the reservoir housing (14), said liquid reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit (1) to the cooling liquid

wherein the reservoir is further provided with channels (26) for establishing a certain flow-path for the cooling liquid

5. a pump (21) being provided inside said reservoir housing (14) as part of an integrate element

said pump (21) comprising an impeller (33)

which is positioned in a separate recess of the channels (26)

where the recess has a size corresponding to the diameter of the impeller of the pump

and has a recess inlet (34) and a recess outlet (32) which is connected to the outlet tube connection (16)

6. a heat exchanger comprising a heat exchanging interface (4) for providing thermal contact between the processing unit (1) and the cooling liquid for dissipating heat from the processing unit (1) to the cooling liquid, where the heat exchanging interface (4) comprises a heat exchanging surface that constitutes part of the liquid reservoir housing (14) facing the processing unit (1)

7. 7.1 where the channels (26) face an inner surface of the heat exchanging interface

forcing the cooling liquid to pass the heat exchanging surface

8. said integrate element comprising the heat exchanging interface (4), the reservoir housing (14) and the pump (21),

wherein said pump (21) is intended for pumping the cooling liquid from the heat radiator

(11) into the reservoir housing (14) through the tube inlet connection (15), through the channels (26),

into the pump through the recess inlet (34) and from the pump (21) through the recess outlet

(32) through the channels and the tube outlet connection (16) to the heat radiator (11)

9. said heat radiator (11) intended for radiating thermal energy from the cooling liquid, dissipated to the cooling liquid, to surroundings of the heat radiator (11)

De beschrijving van EP 771 bevat onder meer de volgende passages:

BACKGROUND OF THE INVENTION

(…)

[0004] A liquid-cooling arrangement is more efficient than an air-cooling arrangement and tends to lower the noise level of the cooling arrangement in general. However, the liquid-cooling design consists of many components, which increases the total installation time, thus making it less desirable as a mainstream solution. With a trend of producing smaller and more compact PCs for the end-users, the greater amount of components in a typical liquid-cooling arrangement is also undesirable. Furthermore, the many components having to be coupled together incurs a risk of leakage of cooling liquid from the system.

SUMMARY OF INVENTION

[0005] It may be one object of the invention to provide a small and compact liquid-cooling solution, which is more efficient than existing air-cooling arrangements and which can be produced at a low cost enabling high production volumes. It may be another object to create a liquid-cooling arrangement, which is easy-to-use and implement, and which requires a low level of maintenance or no maintenance at all. It may be still another object of the present invention to create a liquid-cooling arrangement, which can be used with existing CPU types, and which can be used in existing computer systems.

[0006] This object may be obtained by a cooling system for a computer system, according to claim 1.

(…)

[0017] Providing a plane heat exchanging surface, both the first, inner side and on the second, outer side, results in the costs for manufacturing the heat exchanging surface is reduced to an absolute minimum. However, a plane first, inner surface may also result in the cooling liquid passing the heat exchanging surface too fast. This may be remedied by providing grooves along the inner surface, thereby providing a flow path in the heat exchanging surface. This however results in the costs for manufacturing the heat exchanging surface increasing.

[0018] The solution to this problem according to the invention has been dealt with by providing channels or segments in the reservoir housing instead. The reservoir housing may be manufactured by injection moulding or by casting, depending on the material which the reservoir housing is made from. Proving channels or segments during moulding or casting of the reservoir housing is much more cost-effective than milling grooves along the inner surface of the heat exchanging surface.

(…)

BRIEF DESCRIPTION OF THE FIGURES

[0025] (…)

Fig. 3 shows an embodiment of the prior art. The figure shows the typical components in a liquid-cooling type CPU cooling arrangement.

Fig. 4 is an exploded view of the invention and the surrounding elements.

Fig. 5 shows the parts shown in the previous figure when assembled and attached to the motherboard of a computer system.

Fig. 6 is an exploded view of the reservoir from the previous figures 4 and 5 seen from the opposite site and also showing the pump.

Fig. 7 is a cut-out view into the reservoir housing the pump and an inlet and an outlet extending out of the reservoir.

Fig. 8 is a view of the cooling system showing the reservoir connected to the heat radiator.

Fig. 9-10 are perspective views of a possible embodiment of reservoir housing providing direct contact between a CPU and a cooling liquid in a reservoir.

(…)

Fig. 15-16 are perspective view of a preferred embodiment of a reservoir and a pump and a heat exchanging surface constituting an integrated unit.

(…)

DETAILED DESCRIPTION OF THE INVENTION

(…)

[0039] Fig. 6 is an exploded view of the reservoir shown in previous fig. 4 and fig. 5 and seen from the opposite site and also showing the pump 21 being situated inside the reservoir. Eight screws 22 are provided for attaching the heat exchanging surface 4 to the remainder of the reservoir. The heat exchanging surface is preferably made from a copper plate having a plane outer surface as shown in the figure, said outer surface being intended for abutting the free surface of the heat generating component such as the CPU (see fig. 4). However, also the inner surface (not shown, see fig. 7) facing the reservoir is plane. Accordingly, the copper plate need no machining other than the shaping of the outer boundaries into the octagonal shape used in the embodiment shown and drilling of holes for insertion of the bolts. No milling of the inner and/or the outer surface need be provided.

[0040] A sealant in form of a gasket 13 is used for the connection between the reservoir 14 and the heat exchanging surface forming a liquid tight connection. The pump is intended for being placed within the reservoir. The pump has a pump inlet 20 through which the cooling liquid flows from the reservoir and into the pump, and the pump has a pump outlet 19 through which the cooling liquid is pumped from the pump and to the outlet connection. The figure also shows a lid 17 for the reservoir. The non-smooth inner walls of the reservoir and the fact that the pump is situated inside the reservoir will provide a swirling of the cooling liquid inside the reservoir.

[0041] However, apart from the non-smooth walls of the reservoir and the pump being situated inside the reservoir, the reservoir may be provided with channels or segments for establishing a certain flow-path for the cooling liquid through the reservoir (see fig 9-10 and fig 15). Channel or segments are especially needed when the inner surface of the heat exchanging surface is plane and/or when the inner walls of the reservoir are smooth and/or if the pump is not situated inside the reservoir. In either of the circumstances mentioned, the flow of the cooling liquid inside the reservoir may result in the cooling liquid passing the reservoir too quickly and not being resident in the reservoir for a sufficient amount of time to take up a sufficient amount of heat from the heat exchanging surface. By providing channels or segments inside the reservoir, a flow will be provided forcing the cooling liquid to pass the heat exchanging surface, and the amount of time increased of the cooling liquid being resident inside the reservoir, thus enhancing heat dissipation. If channels or segments are to be provided inside the reservoir, the shape and of the channels and segments may be decisive of whether the reservoir is to be made of plastic, perhaps by injection moulding, or is to be made of metal such as aluminium, perhaps by die casting.

[0042] The cooling liquid enters the reservoir through the tube inlet connection 15 and enters the pump inlet 20, and is pumped out of the pump outlet 19 connected to the outlet connection 16. (...)

(…)

[0051] Fig. 7 is a cut-out view into the reservoir, when the reservoir and the heat exchanging surface 4 is assembled and the pump 21 is situated inside the reservoir. The reservoir is provided with the tube inlet connection (not seen from the figure) through which the cooling liquid enters the reservoir. Subsequently, the cooling liquid flows through the reservoir passing the heat exchanging surface and enters the inlet of the pump. After having been passed through the pump, the cooling liquid is passed out of the outlet of the pump and further out through the tube outlet connection 16. The figure also shows a lid 17 for the reservoir. The flow of the cooling liquid inside the reservoir and trough the pump may be further optimised in order to use as little energy as possible for pumping the cooling liquid, but still having a sufficient amount of heat from the heat exchanging surface being dissipated in the cooling liquid. This further optimisation can be established by changing the length and shape of the tube connection inlet within the reservoir, and/or by changing the position of the pump inlet, and/or for instance by having the pumping device placed in the vicinity and in immediate thermal contact with the heat exchanging surface and/or by providing channels or segments inside the reservoir.

[0052] In this case, an increased turbulence created by the pumping device is used to improve the exchange of heat between the heat exchanging surface and the cooling liquid. Another or an additional way of improving the heat exchange is to force the cooling liquid to pass through specially adapted channels or segments being provided inside the reservoir or by making the surface of the heat exchanging surface plate inside the reservoir uneven or by adopting a certain shape of a heat sink with segments. In the figure shown, the inner surface of the heat exchanging surface facing the reservoir is plane.

[0053] Fig. 8 is a perspective view of the cooling system showing the reservoir 14 with the heat exchanging surface (not shown) and the pump (not shown) inside the reservoir. The tube inlet connection and the tube outlet connection are connected to a heat radiator by means of connecting tubes 24 and 25 through which the cooling liquid flows into and out of the reservoir and the heat radiator, respectively. Within the heat radiator 11, the cooling liquid passes a number of channels for radiating the heat, which has been dissipated into the cooling liquid inside the reservoir, and to the surroundings of the heat exchanger. The air fan 10 blows air past the channels of the heat radiator in order to cool the radiator and thereby cooling the cooling liquid flowing inside the channels through the heat radiator and back into the reservoir.

[0054] According to the invention, the heat radiator 11 may be provided alternatively. The alternative heat radiator is constituted by a heat sink, such as a standard heat sink made of extruded aluminium with fins on a first side and a substantially plane second side. (…)

[0055] (…) The reservoir may be provided with channels or segments for establishing a certain flow-path for the cooling liquid through the reservoir. Channels or segments are especially needed when the inner surface of the heat exchanging surface is plane and/or when the inner walls of the reservoir are smooth and/or if the pump is not situated inside the reservoir. In either of the circumstances mentioned, the flow of the cooling liquid inside the reservoir may result in the cooling liquid passing the reservoir too quickly and not being resident in the reservoir for a sufficient amount of time to take up a sufficient amount of heat from the heat exchanging surface. (…)

(…)

[0057] The alternative heat radiator provided as an unit constituted by a heat sink and a reservoir, may be used solely, with or without a pump inside the reservoir and with or without the segments or channels, for being placed in direct or indirect thermal contact with a heat generating processing unit such as a CPU or with the heat exchanging surface, respectively. (…) In another example of the invention, which may be derived from fig. 8, the air fan and the heat radiator is placed directly in alignment of the reservoir. Thereby, the reservoir 14, the air fan 10 and the radiator 11 constitute an integrate unit. (…)

(…)

[0073] Fig. 15-16 show a possible embodiment of a reservoir according to the invention. The reservoir is basically similar to the reservoir shown in fig. 9-10. However, an impeller 33 of the pump of the cooling system is provided in direct communication with the channels 26. Also, in the embodiment shown, a heat exchanging interface 4 such as a surface made from a copper plate, alternatively a plate of another material having a high thermal conductivity, is placed between the channels 26 inside the reservoir and the CPU 1 as the processing unit.

(…)

[0079] The impeller 33 (see fig. 15) of the pump is positioned in a separate recess of the channels 26, said separate recess having a size corresponding to the diameter of the impeller of the pump. The recess is provided with an inlet 34 and an outlet 35 being positioned opposite an inlet 15 and an outlet 16 of cooling liquid to and from, respectively, the channels 26.

In het octrooi zijn onder meer de volgende figuren opgenomen:

Het prioriteitsdocument US 924

Het prioriteitsdocument betreft een octrooi met dezelfde aanduiding als EP 771, te weten “Cooling system for a computer system”. De beschrijving van het prioriteitsdocument bevat onder meer de volgende passages:

BACKROUND OF THE INVENTION

SUMMARY OF INVENTION

(…)

In preferred embodiments according to this aspect of the invention, the pump is placed inside the reservoir with at least an inlet or an outlet leading to the liquid in the reservoir. In an alternative embodiment the pump is placed outside the reservoir in the immediate vicinity of the reservoir and wherein at least an inlet or an outlet is leading directly to the liquid in the reservoir. By placing the pump inside the reservoir or in the immediate vicinity outside the reservoir, the integrity of the combined reservoir, heat exchanger and pump is obtained, so that the element is easy to employ in new and existing computer systems, especially mainstream computer systems. (p. 2, r. 33-38 en p. 3, r. 1-2)

(…)

According to an aspect of the invention, the pump is selected from the following types:

Bellows pump, centrifugal pump, diaphragm pump, drum pump, flexible liner pump, flexible impeller pump, gear pump, peristaltic tubing pump, piston pump, processing cavity pump, pressure washer pump, rotary lobe pump and rotary vane pump. By adopting one or more of the solution of the present invention, a wide variety of pumps may be used without departing from the scope of the invention. (p. 4, r. 1-6)

(…)

BRIEF DESCRIPTION OF THE FIGURES

(…)

DETAILED DESCRIPTION OF THE INVENTION

(…)

In this case, an increased turbulence created by the pumping device is used to improve the exchange of heat between the heat exchanger and the liquid. Another or an additional way of improving the heat exchange is to force the liquid to pass through specially adapted channels or segments being provided inside the reservoir or by making the surface of the heat exchanger plate inside the reservoir uneven or by adopting a certain shape of a heat sink with segments. (p. 10 r. 11-16)

(…)

De conclusies van het prioriteitsdocument luiden, voor zover van belang, als volgt:

CLAIMS

1. A cooling system for a computer system, said computer system comprising.

- at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit,

- a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit tot he cooling liquid,

- a heat exchanging surface being in close thermal contact with the processing unit for dissipating heat from the processing unit to the cooling liquid for being accumulated by the liquid,

- a pumping means being provided as part of an integrate element, said integrate element comprising the heat exchanging surface, the reservoir and the pump,

- said pump intended for pumping the cooling liquid into the reservoir, through the reservoir and from the reservoir to a heat radiating means,

- said heat radiating means intended for radiating thermal energy from the cooling liquid, dissipated to the cooling liquid, to surroundings of the heat radiating means.

2. A cooling system according to claim 1, wherein the pump is placed inside the reservoir with at least an inlet or an oulet leading to the liquid in the reservoir.

(…)

7. A cooling system according to any of the preceding claims, where the pump is selected

from the following types: Bellows pump, centrifugal pump, diaphragm pump, drum pump,

flexible liner pump, flexible impeller pump, gear pump, peristaltic tubing pump, piston

pump, processing cavity pump, pressure washer pump, rotary lobe pump and rotary vane

pump.

(…)

9. A cooling system according to any of the preceding claims, where one or more of the

following means are provided inside the reservoir for increasing the heat absorption by the

liquid: channels or segments inside the reservoir, an uneven surface being provided on the

inside surface of the heat exchanging surface, a heat sink with segments provided inside

the reservoir and being in thermal contact with the heat exchanging surface.

(…)

Het prioriteitsdocument bevat acht figuren die identiek zijn aan de eerste acht figuren van het octrooi. De figuren 9 t/m 16 uit het octrooi komen niet voor in het prioriteitsdocument.

De stand van de techniek rondom de prioriteitsdatum

Op 1 februari 2000 is het Amerikaanse octrooi US 6.019.165 (hierna: Batchelder) verleend aan een vinding met de aanduiding “Heat exchange apparatus”. Het abstract ervan luidt als volgt:

An apparatus to transfer heat from a heat source to a heat absorber, the apparatus consisting of an active thermal spreader plate with internal flow channels, a recirculating heat transfer fluid, and a means to impel the heat transfer fluid using an external moving magnetic field. In the most preferred embodiment a centripetal pump impeller is trapped inside the active thermal spreader plate, and the impeller is motivated to rotate due to eddy currents generated by the external moving magnetic fields.

Op 23 juli 2003 is het Chinese gebruiksmodel met nummer CM 2562368Y (hierna: Yu) gepubliceerd, met als aanduiding in de overgelegde Engelse vertaling “Liquid-cooled heat sink”. Het abstract ervan luidt – in de Engelse vertaling – als volgt:

The utility model discloses a liquid-cooled heat sink which comprises a base, a fan, a water pump and a water circulation loop. The base is internally provided with a storage space, which is provided with two inlet/outlets and serves to accommodate cooling water. The fan is disposed on the base and is provided with a fan blade body that is driven to rotate by a motor. The water pump is disposed opposite to the fan blade body of the fan and positioned inside the storage space of the base. A magnetic connector unit is disposed between the fan blade body and the water pump. The water circulation loop is connected to the two inlet/outlets of the base. The above arrangement constitutes a device for the forced heat dissipation of electronic heaters such as a central processing unit via a water-cooled mechanism.

Op 27 november 2003 is de internationale octrooi-aanvraag met nummer WO 03/098415 A1 gepubliceerd (hierna: WO 415). Deze aanvraag heeft als titel “A liquid cooling device for a notebook computer” en bevat op pagina 30 de volgende passage:

The turbulent heat exchange may be promoted by increasing the surface roughness of an inside wall of the pump chamber 15 by shot blasting, shot peening or the like. This is because the heat transfer area is increased by increasing the surface roughness and because the heat transfer is enhanced by the more violent turbulent flow.

Op 7 april 2004 is het Chinese gebruiksmodel met nummer CN 2610125Y (hierna: Lin) gepubliceerd met de aanduiding – in de door Cooler Master overgelegde Engelse vertaling – “Water pumping motor device with chamber”.

In de vertaling van Lin is onder meer het volgende opgenomen:

op pagina 1/1:

Claims

1. A water pumping motor device with chamber, composed of a base and a water pumping device, characterised in that: a chamber and a holding space are provided within the base, with the chamber and the holding space connected to the same water inlet bore and the chamber covered on its top with a board. The water pumping device has a pump impeller, which is accommodated within the holding space of the base, and provided above the pump impeller are in succession a driving wheel and a motor, with the latter capable of driving the driving wheel and causing the pump impeller to rotate.

2. The water pumping motor device with chamber according to Claim 1, characterised in that: The side wall of the base is provided with a water inlet bore, which connects to the chamber, and a water outlet bore, which connects to the holding space; the water outlet and water inlet bores of the base can be connected to an annular tube, the other end of which connects to a heat sink.

3. The water pumping motor device with chamber according to Claim 1, characterised in that: a cover unit is provided between the pump impeller of the water pumping device and the driving wheel. The cover unit is placed above the holding space of the base, with the inner edge of the cover unit being a flange.

(…)

6. The water pumping motor device with chamber according to Claim 1, characterised in that: a concave annular groove is provided along the inside wall of the holding space of the base.

7. The water pumping motor device with chamber according to Claim 1, characterised in that: the base can be slotted into the motherboard of a host computer.

8. The water pumping motor device with chamber according to Claim 1, characterised in that: the surface of the board of the base is provided with a plurality of fins.

9. The water pumping motor device with chamber according to Claim 1, characterised in that: the base is provided with a deflector.

(…)

en in de beschrijving op pagina 1/3:

Description

A Water Pumping Motor Device with Chamber

Technical field

This utility model relates to a type of heat sinks used in the central processors of computers, particularly to a type of water pumping motor devices with chamber, so that a water pumping device, which is accommodated in the holding space of its base, draws water from the chamber so as to recycle it to achieve the purpose of dissipating heat and cooling. Its chamber is very slim, small, saves space and is capable of working in combination with fins or a fan, making it an excellent cooling system when the chamber is installed in CPU to assist with cooling.

(…)

Scope of the utility model

The primary purpose of this utility model is to come up with: a type of water pumping motor device with chamber, which not only saves space, but is also portable and easy to move around, with its water pumping device accommodated in the chamber of its base and its motor being used to drive the pump impeller so that the liquid coolant in the chamber is circulated, thereby forming the construction of a water-cooled heat sink.

en op een ongenummerde pagina van de beschrijving:

The secondary purpose of this utility model is to provide: a plurality of fins on the surface of the board of the base, which is capable of being mounted onto the central processor of the circuit board, so as to lower the high temperature of the central processor quickly.

(…)

One other purpose of this utility model is to achieve: the purpose of assisting a heat sink in quickly dissipating heat by means of circulating liquid coolant from the chamber in a thermal module, which is connected to the two ends of the water outlet tube and the water inlet tube, the other two ends of which are connected to the water outlet bore and the water inlet bore provided on the side walls of the base.

One other purpose of this utility model is to achieve: the circulation and direction of water coming in via the water inlet bore of the base by means of a deflector, which may be provided inside the chamber within the base, and the subsequent discharge of water from the water outlet bore.

This new utility model is realised in the following way: the water pumping motor device with chamber, comprising a base and a water pumping device, whereby a chamber and a holding space are provided within the base, with the chamber and the holding space connected to the same water inlet bore and the chamber covered on its top with a board. The water pumping device has a pump impeller, which is accommodated within the holding space of the base, and provided above the pump impeller are, in succession, a driving wheel and a motor, with the latter capable of driving the driving wheel and causing the pump impeller to rotate. The side wall of the base is provided with a water inlet bore, which connects to the chamber, and a water outlet bore, which connects to the holding space; the water outlet and water inlet bores of the base can be connected to an annular tube, the other end of which connects to a heat sink. A cover unit is provided between the pump impeller of the water pumping device and the driving wheel; the cover unit is placed above the holding space of the base, with the inner edge of the cover unit being a flange. A magnetic unit is provided on the pump impeller of the water pumping device. The driving wheel is made of magnetic material. a concave annular groove is provided along the inside wall of the holding space of the base. The base can be slotted into the motherboard of a host computer. The surface of the board of the base is provided with a plurality of fins. The base is of a metal material with good thermal conductivity, such as copper or aluminium, and a deflector is provided in the base.

When compared to the current technologies, the present utility model offers the following advantages: This utility model, a water pumping motor device with chamber, is composed of a base and a water pumping device, whereby a chamber and a holding space are provided within the base, with the chamber and the holding space connected to the same water inlet bore and the chamber covered on its top with a board. In addition, the pump impeller of the water pumping device is accommodated within the holding space of the base, and provided above the pump impeller are, in succession, a driving wheel and a motor, with the latter capable of driving the driving wheel and causing the pump impeller to rotate, so that cooling water is drawn from the

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chamber by the pump impeller and discharged through a water outlet bore before entering into the chamber through the water inlet bore again in repeated cycles. This utility model of water pumping motor device with chamber has the capability of reducing the overall size, giving it the advantages of being easy to transport, move and space-saving.

Description of the drawings

Figure1is a three-dimensional schematic view of the present utility model.

Figure 2 is a three-dimensional exploded view of the present utility model.

Figure 3 is an overhead cross-sectional view of the present utility model.

Figure4is a three-dimensional schematic view of the most preferred embodiment of this new utility model.

Figure5is a three-dimensional schematic view of another embodiment of this new utility model.

Figure6is a three-dimensional schematic view of the second embodiment of this new utility model in actual use.

Figure 7 is a schematic view of another embodiment of this new utility model.

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Embodiments:

Illustrated in Figures 1, 2 and 3 are: a three-dimensional schematic view, a three-dimensional exploded view and an overhead cross-sectional view of this new utility model, from which we see that this new utility model comprises a base 1, a water pumping device 2 and a motor 3. A chamber 11 and a holding space 12are provided within the base1, with the chamber 11and the holding space 12 connected to the same water inlet bore 13and the chamber 11 covered on its top with a board 14; The side wall of the base1 is provided with a water inlet bore 111, which connects to the chamber 11, and a water outlet bore 121, which connects to the holding space 12; a concave annular groove 122 is provided along the inside wall of the holding space 12: the water pumping device 2, installed in the holding space 12 of the base 1, comprises a pump impeller 21, a cover unit 22, a driving wheel 23; the pump impeller 21 is provided with a magnetic unit 211, the centre of which has a round hole 212. On top of the pump impeller 21, there is a cover unit 22, the exterior surface of which has a flange 221, which slots into the concave annular groove 122 of the holding space 12 in the base 1 so that the cover unit 22 can be mounted securely inside the holding space 12. The cover unit 22 is provided with a concave container 222, in which a magnetic driving wheel 23 is placed, while the magnetic driving wheel 23 is provided with a shaft bore 231, so that the rotating pivot shaft 31 of motor 3 can be inserted into the

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shaft bore 231 of driving wheel23 of the water pumping device 2. When assembled, the shaft of motor 3 is mounted onto the water pumping device 2, so that motor 3 is utilized to rotate driving wheel 23, which in turn rotates pump impeller 21. Water is drawn from

chamber 11 through water inlet bore 13 by pump impeller 21 and then travels through holding space 12 before being discharged via water outlet bore 121 and then returns to chamber 11 via the water inlet bore 111, so as to achieve the purpose of water recycling.

Illustrated in Figure 4 is a three-dimensional schematic view of the most preferred embodiment of this new utility model. From the figure, we can see that the surface of board 14 of base 1 is provided with heat-dissipating fins 15, which allows for base 1 to be stuck onto a central processor directly, thereby allowing it to become a heat sink of the central processor. Taking advantage of the excellent cooling effect brought about by the recycling cooling water in base 1, assisted with the heat-dissipating fins 15, the efficiency and effect of cooling is enhanced.

Illustrated in Figures 5 and 6 are a three-dimensional schematic view of another embodiment of this new utility model, and a three-dimensional schematic view of this embodiment in actual use. From the figures, we can see that base 1 can be mounted and dismounted from the slot of the motherboard of a host computer. The water inlet

bore 111 and the water outlet bore 121 of base 1 are connected to tubes 41 of heat sink 4, while the heat sink 4 is installed in a position which requires heat dissipation inside a host computer 5. The cooling water of base 1 is drawn into heat sink 4 along tubes 41 via water outlet bore 121 to assist heat dissipation by heat sink 4. The cooling water in heat sink 4 re-enters base 1 by travelling along tubes 41 via water inlet bore 111 so as to achieve the effect of recycling and increase the speed of heat dissipation effectively.

Illustrated in Figure 7 is a schematic view of another embodiment of the present new utility model, in which the holding space 11 of base 1 may be provided with deflector 16. When water is drawn by pump impeller 21 in holding space 11 as it rotates, it is directed by deflector 16 so that it recycles and is discharged from water outlet bore 121 as directed by deflector 16. Water is therefore recycled, directed and the area of heat transfer thus increased.

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